List of Assemblies  tested in May 99 Test beam
 
 

Single chips


 

#

Rad

Sensor

prot.

Chip

thickn.

Supplier

Bonder

Lab
1 N SSG 1b FEB 200 CIS IZM LBL
2 N SNB 1b FEB 200 CIS IZM LBL
3 N SSG 1b FEC 280 CIS IZM LBL
4 N ST1 1b FEB 280 CIS IZM LBL
5 .5 10**15 ST2 1 FEB 280 CIS Boeing LBL
6 .5 10**15 ST2 1 FEB 280 CIS Boeing LBL
7 1. 10**15 ST2 1 FEB 280 CIS Boeing LBL
8 N ST2-dm 1 FEC 280 CIS IZM BONN
9 N SSG 1 FEC 280 CIS IZM BONN
10 N SSG 1b FEC 280 CIS IZM BONN
11 N ST2 1 FEC 280 CIS IZM BONN
12 N SSG 1b FEC 200 CIS IZM BONN
13 N SSG 1b FEB 280 CIS IZM BONN
14 N ST2   FEB 280 CIS ALENIA GE
15 N ST1   FEC 280 CIS ALENIA GE
16 N ST2   FEC 280 CIS ALENIA GE
17 .5 10**15 SSG 1b FEC 280 CIS ALENIA GE
18 .25  10**15 SSG 1b FEC 280 CIS ALENIA GE
19 N MCMD-ST1 1 FEB 300 SEIKO IZM LBL
20 N MCMD-ST2 1 FEB 300 SEIKO IZM LBL
21 N MCDM-ST1 1 FEC 300 SEIKO IZM Wuppertal A
22 N MCDM-ST1 1 FEC 300 SEIKO IZM Wuppertal B
23 N MCDM-ST2 1 FEC 300 SEIKO IZM Wuppertal 
24 N SAN 1 FEB 280 CIS ALENIA GE Analog

Modules


 

#

Rad

Sensor

prot.

Chip

thickn.

Supplier

Bonder

Lab
M1 N Tile 1 1 FEB 280 CIS IZM LBL Bare
M2 N Tile 1 1b FEB 200 CIS IZM LBL FLEX
M3 N Tile 2 1 FEC 300 SEIKO IZM BONN Bare
M4 N Tile 2 1b FEC 200 CIS IZM BONN Bare
M5 N Tile 1 1 FEC   SEIKO ALENIA GE Bare

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